About the job
Join Tenstorrent, a trailblazer in AI technology, where we are transforming performance standards, usability, and cost-effectiveness. As AI reshapes the computing landscape, we evolve our solutions to seamlessly integrate innovations across software models, compilers, platforms, networking, and semiconductors. Our multidisciplinary team of tech enthusiasts has developed a high-performance RISC-V CPU from the ground up, driven by a strong passion for AI and a commitment to creating the premier AI platform. We cherish collaboration, curiosity, and a dedication to tackling challenging problems. We are expanding our team and are eager to welcome contributors of various experience levels.
As a member of Tenstorrent’s Automotive Robotics team, you will play a pivotal role in designing and delivering core hardware modules for our next-generation chiplet-based SoCs tailored for automotive applications. You will serve as a liaison between silicon design, DFT, OSAT partners, and customers, ensuring our multi-die SiP platforms achieve stringent performance, quality, and safety benchmarks.
This position is remote, with a base in Munich, Germany.
We encourage candidates with diverse experience levels to apply. During the interview process, we will assess candidates for the suitable level, and offers will be adjusted accordingly, which may differ from this posting.
