About the job
Join ASM, where innovation meets collaboration in the world of advanced technology.
With over 55 years of leadership in the semiconductor industry, ASM continues to set the standard for innovation and technological advancement. Our diverse team of more than 4,500 professionals from 70 nationalities drives progress in critical sectors such as 5G, cloud computing, AI, and autonomous driving. Beyond technology, we are committed to diversity, inclusion, and sustainability, ensuring that our contributions positively impact the world. Our development programs foster personal and professional growth, empowering you to push the boundaries of innovation.
As a Field Process Engineer specializing in Plasma-Enhanced Atomic Layer Deposition (PEALD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) on ASM’s XP8 DCM/QCM platforms, you will serve as the on-site process authority at our customers' high-volume manufacturing fabs. Your role will involve optimizing deposition processes, addressing technical challenges, and ensuring that tool performance aligns with both customer and ASM standards. This position is perfect for engineers who thrive in hands-on problem-solving situations and fast-paced environments, contributing to the future of semiconductor manufacturing.

