About the job
About Etched
Etched is pioneering the development of the world's first AI inference system specifically designed for transformer models, achieving over 10x the performance and significantly lower costs and latency compared to traditional methods like B200. With our proprietary ASICs, you can create revolutionary products, such as real-time video generation models and highly sophisticated reasoning agents. Supported by substantial investments from top-tier investors and driven by a team of leading engineers, Etched is transforming the infrastructure for the fastest-growing industry of our time.
Job Overview
We are looking for a talented Substrate IC Package Layout Design Engineer to join our dynamic team. In this role, you will oversee the complete design process of intricate IC substrate packages, catering to high-power consumption and high-speed signaling requirements. The ideal candidate will bring substantial experience in large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and exceeding 50GHz). You will collaborate closely with silicon, signal integrity, power integrity, and system engineering teams to co-design state-of-the-art substrates with OSAT providers, with a strong emphasis on optimizing power delivery through substrate technology.
Key Responsibilities
Lead the design and development of sophisticated IC substrate layouts for high-performance AI processors and accelerators.
Design complex multi-layer substrate packages (>50mm) with high pin counts and intricate routing requirements.
Ensure robust power delivery designs capable of supporting custom silicon solutions exceeding 700W.
Develop high-speed signal routing solutions that facilitate >50GHz signaling while minimizing issues such as loss and crosstalk.
Work alongside SI/PI engineers to determine signal integrity and power integrity requirements, implementing effective solutions within the substrate layout.
Optimize CoWoS (Chip-on-Wafer-on-Substrate) designs for enhanced thermal and electrical performance.
Collaborate with chip design, packaging, and manufacturing teams to ensure design feasibility and manufacturability.
Conduct design validation and verification processes to ensure compliance with specifications.