Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Material Science, or a related technical discipline.Minimum of 5 years of experience in package architecture, IC packaging, or PCB design engineering.Proficient in advanced packaging technologies, signal integrity simulation, and electrical analysis of high-speed interconnects (e.g., DDR2, SATA, PCIe).Demonstrated success in developing package design processes, including stack-up configuration, substrate design, die-fit analysis, and pin-out definition.Hands-on experience with signal integrity simulation tools such as HFSS, Sigrity, or CST Microwave Studio.Knowledge of packaging technology considerations such as die fit analysis, power distribution planning, routing tradeoff studies, and signal integrity issues.Exemplary project management and communication skills to effectively guide cross-functional teams.
About the job
Solidigm is on the lookout for a forward-thinking Package Developer to spearhead the exploration and advancement of packaging technologies for Solid State Drives (SSDs) and NAND flash storage card applications. In this pivotal role, you will innovate packaging technologies that align with the SSD product roadmap. Your responsibilities will encompass the design and development of package structures, which include package stack-up and configuration, substrate design, design collaterals, package pin assignments, signal integrity simulations, and liaising with internal and external standards forums. Furthermore, you will lead the tracking of package design milestones, integrate product requirements into packaging solutions, troubleshoot packaging design challenges, and communicate design progress effectively.
- Conduct die fit analysis, stack-up, reference plane, and power distribution assessments for multi-die NAND packages.
- Define device package pin-out and I/O bus interface specifications.
- Integrate high-speed electrical signaling design requirements, high-volume assembly design rules, and emerging IC packaging techniques into your projects.
- Perform package and/or PCB routing studies to analyze cost-performance trade-offs.
- Design, analyze, and validate off-silicon platform interconnects, focusing on memory interfaces like DDR2 and high-speed differential I/O interfaces such as SATA or PCIe.
- Develop electrical modeling capabilities and analysis techniques for busses and interconnects.
- Collaborate with subcontractors to advance packaging design rules aligned with the product roadmap.
About Solidigm
Join a multibillion-dollar global leader that merges cutting-edge technology with a vibrant workforce and operational excellence to dominate the memory industry. Headquartered in Rancho Cordova, California, Solidigm fuses the attributes of an established, successful technology enterprise with the agility and innovative spirit of a start-up. With a robust presence in the U.S. and international operations across Asia, Europe, and the Americas, Solidigm is committed to pioneering new memory technologies, aspiring to be the premier NAND memory company globally. We embrace challenges as opportunities to develop groundbreaking solutions that can transform the future. At Solidigm, we are united as One Team, cultivating a diverse, equitable, and inclusive culture that values individual uniqueness and empowers everyone to bring their best selves to deliver exceptional results.
