About the job
Cerebras Systems is at the forefront of AI technology, having developed the largest AI chip globally, which is 56 times larger than traditional GPUs. Our innovative wafer-scale architecture delivers the computational power typically associated with dozens of GPUs, all within a single chip, providing unparalleled programming simplicity. This revolutionary approach enables us to achieve unmatched training and inference speeds, empowering machine learning practitioners to run extensive ML applications seamlessly, without the complexities of managing multiple GPUs or TPUs.
Cerebras serves a diverse clientele, including leading model labs, major global enterprises, and pioneering AI-native startups. Recently, OpenAI announced a multi-year partnership with Cerebras to leverage 750 megawatts of scalable power, significantly enhancing critical workloads through ultra-high-speed inference.
The groundbreaking architecture of Cerebras Inference provides the fastest Generative AI inference solution available, boasting speeds over ten times faster than GPU-based hyperscale cloud inference services. This remarkable acceleration is transforming user experiences in AI applications, enabling real-time iterations and enhancing intelligence through advanced computation techniques.
Lead Advanced Packaging Technologist
We are looking for an experienced Lead Advanced Packaging Technologist to spearhead the development, integration, and deployment of next-generation semiconductor packaging technologies. This pivotal role involves architecting and implementing advanced, high-performance, and high-density packaging solutions that support cutting-edge compute, AI, and heterogeneous integration platforms.

