About the job
Join ASM and embark on a journey where innovative technology meets a vibrant culture.
With over 55 years of pioneering advancements, ASM is a leader in the semiconductor industry, shaping the future of technology. Our diverse team of over 4,500 professionals from 70 nationalities collaborates to push the limits of what’s achievable, contributing to significant developments in 5G, cloud computing, AI, and autonomous driving. We believe in fostering a culture of diversity, inclusion, and sustainability, making a positive impact on the world while supporting the growth of our employees through comprehensive development programs.
As a Principal Engineer in Hardware, specializing in Advanced Packaging, you will be instrumental in advancing our semiconductor process technologies. Your deep knowledge of thin-film deposition and materials characterization will drive the creation of innovative solutions for the next generation of devices. Your contributions will directly enhance product performance and facilitate breakthroughs in logic, memory, and power applications. We are excited to invite applications for multiple openings!

