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Principal Engineer, Hardware - Advanced Packaging

ASM InternationalUS > Arizona > Phoenix
On-site Full-time

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Experience Level

Mid to Senior

Qualifications

Responsibilities:Research, develop, and optimize semiconductor processes with a focus on Advanced Packaging, including depositions and surface preparation. Design and execute complex experiments utilizing DOE and RSM methodologies; analyze and interpret experimental results. Troubleshoot equipment issues through hands-on engagement and ensure seamless product transfer to customers. Provide expert technical support for intricate electro/mechanical equipment and computer systems. Address and resolve issues escalated by first-line product support teams. Report design, reliability, and maintenance issues to engineering teams for prompt resolution. Assist in customer installations and offer technical training as required. Deliver support for highly technical products to customers and users. Travel globally up to 50% to support field operations. Qualifications:Master’s or PhD in Mechanical or Electrical Engineering preferred.10+ years of education, research, and professional experience in thin-film deposition and advanced packaging processes. At least 5 years of experience in semiconductor process engineering or semiconductor equipment technology. Ability to apply technical knowledge and problem-solving skills effectively.

About the job

 

Join ASM and embark on a journey where innovative technology meets a vibrant culture.

With over 55 years of pioneering advancements, ASM is a leader in the semiconductor industry, shaping the future of technology. Our diverse team of over 4,500 professionals from 70 nationalities collaborates to push the limits of what’s achievable, contributing to significant developments in 5G, cloud computing, AI, and autonomous driving. We believe in fostering a culture of diversity, inclusion, and sustainability, making a positive impact on the world while supporting the growth of our employees through comprehensive development programs.

As a Principal Engineer in Hardware, specializing in Advanced Packaging, you will be instrumental in advancing our semiconductor process technologies. Your deep knowledge of thin-film deposition and materials characterization will drive the creation of innovative solutions for the next generation of devices. Your contributions will directly enhance product performance and facilitate breakthroughs in logic, memory, and power applications. We are excited to invite applications for multiple openings!

About ASM International

ASM International is at the forefront of semiconductor innovation, dedicated to pushing technological boundaries for over five decades. Our commitment to fostering diversity and sustainability underpins our mission to make a positive impact globally. With a focus on employee development, we empower our team to drive advancements in critical technology areas.

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