About the job
Key Responsibilities:
- Lead the development and execution of System in Package (SiP) assembly and integrated circuit (IC) packaging materials and processes that adhere to quality, reliability, cost, yield, and productivity standards.
- Oversee the qualification programs for new package processes, including Surface Mount Technology (SMT), Flip Chip, and Underfill.
- Create and maintain comprehensive process documentation, encompassing standard operating procedures and work instructions.
- Conduct experiments to thoroughly characterize materials and processes from initial pathfinding through development to high-volume ramp-up.
- Utilize statistical knowledge and problem-solving tools to devise solutions that enhance quality, reliability, cost-effectiveness, yield, and process stability and capability.
- Establish and manage process control systems, supporting the transition to high-volume manufacturing and contributing to new factory startups.
- Act as a point of contact and liaison with suppliers and vendors.
- Maintain and improve product quality while implementing cost reduction initiatives for packaging.
- Facilitate the introduction of new packaging processes into production environments.
- Work collaboratively with cross-functional teams to lead and drive continuous improvement projects in Flip Chip technology.
- Engage closely with process, equipment, factory automation, and IT teams to develop robust and efficient automation solutions.
