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Senior IC Packaging Designer

FalcommAtlanta, Georgia, United States
On-site Full-time

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Experience Level

Mid to Senior

Qualifications

Key Responsibilities:Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages. Create intricate package layouts, bond diagrams, and substrate routing utilizing advanced semiconductor packaging EDA tools. Work closely with signal integrity, electromagnetic (EM), and thermal simulation teams to validate package performance. Compile comprehensive package documentation, fabrication drawings, and assembly specifications. Engage in design reviews, prototype builds, and failure analysis to enhance RF performance and yield. Collaborate with RFIC designers for chip and package co-optimization, minimizing parasitics and signal loss. Support package integration efforts with PCB design teams to ensure optimal RF performance at the system level. Coordinate effectively with fabrication and assembly partners. Minimum Qualifications:Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.3-5 years of experience in designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition. Solid understanding of electrical, thermal, materials, or mechanical engineering principles pertinent to IC packaging. Willingness to work full-time, onsite in Atlanta, GA. Preferred Skills:Experience with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and familiarity with high-speed interface requirements like DDR or PCIe. Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre. Experience in RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to enhance design workflows. Ability to develop accurate 3D models of packages.

About the job

If you are driven by a passion for advancing semiconductor technologies and shaping the future of wireless systems, then Falcomm is the perfect place for you. We are dedicated to translating groundbreaking semiconductor research into practical, high-performance solutions through our innovative RF power amplifier technologies. Our mission is to pioneer state-of-the-art wireless solutions that redefine performance, efficiency, and integration.

We are currently looking for a talented Senior IC Packaging Designer to join our dynamic team. In this pivotal role, you will be instrumental in the development and execution of sophisticated semiconductor packaging solutions for RF integrated circuits. Your primary focus will be on designing and optimizing packaging architectures that enhance high-frequency performance, thermal efficiency, and manufacturability. This role requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure the seamless integration of silicon, GaN, or III-V MMIC devices into production-ready packages.

About Falcomm

At Falcomm, we are at the forefront of semiconductor innovation, transforming research into practical, high-performance applications. Our commitment to energy-efficient RF power amplifier technologies enables us to push the envelope in wireless solution performance and efficiency, paving the way for next-generation systems.

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