About the job
Join ASM, where innovation meets collaboration.
For over 55 years, ASM has been a leader in semiconductor technology, driving advancements in high-performance computing, cloud computing, AI, and more. With a diverse workforce of over 4,500 employees from 70 different nationalities, we are committed to fostering diversity, inclusion, and sustainability in our operations. Our development programs empower your growth, pushing the boundaries of innovation while making a positive impact on the world.
Your Role
As a senior leader in process engineering at ASM, you will spearhead the development of high-thermal-conductivity thin films, essential for next-generation high-performance computing and advanced packaging solutions. You will lead a specialized team focused on creating advanced thermal films that meet the evolving demands of the industry, utilizing ALD/PEALD, CVD/PECVD, and related technologies. Your expertise will translate customer requirements into innovative materials and processes, positioning ASM as a leader in thermal management for heterogeneous integration across various device types.
Your Responsibilities
- Lead and mentor a team of process development engineers to innovate high thermal conductivity thin films for advanced packaging and HPC applications.
- Own and execute the roadmap for developing materials that meet customer performance and integration demands.
- Utilize ASM’s expertise in ALD/PEALD, CVD/PECVD, and surface preparation to design and optimize high thermal conductivity materials.
- Drive process development initiatives, focusing on deposition rate, uniformity, material properties, and bondability.
- Define and influence hardware requirements in collaboration with engineering teams to meet advanced process specifications.
- Engage with customers, Account Technology Directors, Product Management, and Business Development to ensure alignment on high thermal conductivity solutions.

