About the job
Embark on a rewarding career with ASM, where innovation meets collaboration.
For more than 55 years, ASM has been a leader in technology and innovation, paving the way for what’s technologically possible. With a diverse team of over 4,500 ASMers from 70 nationalities, we are at the forefront of groundbreaking trends such as 5G, cloud computing, AI, and autonomous driving. More than just a tech company, we champion diversity, inclusion, and sustainability, making a positive impact on the world. Our development programs are designed to support your growth, shaping your future and pushing the boundaries of innovation.
In the role of (Senior) Principal Engineer in Process and Hardware, Advanced Packaging, you will be instrumental in advancing ASM’s semiconductor process technologies. Your expertise in thin-film deposition and materials characterization will be pivotal in developing innovative solutions for next-generation devices. Your contributions will directly enhance product performance and facilitate breakthroughs across logic, memory, and power applications. We are currently looking for multiple candidates to join our dynamic team.

