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(Senior) Principal Engineer in Process and Hardware - Advanced Packaging

ASM InternationalUS > Arizona > Phoenix
On-site Full-time

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Experience Level

Senior

Qualifications

Key Responsibilities:Conduct research, development, and optimization of semiconductor processes centered around Advanced Packaging, including depositions and surface preparation. Design and execute complex experiments utilizing DOE and RSM methodologies; interpret and analyze experimental data. Collaborate closely with customers and marketing teams to define requirements and successfully execute demonstrations. Troubleshoot equipment issues through hands-on engagement to ensure successful product transfer to customers. May supervise process engineering technicians and provide insights on performance evaluations. Deliver expert technical support for complex electro/mechanical equipment and computer systems. Respond to and resolve issues escalated by first-line product support teams. Report design, reliability, and maintenance issues to engineering teams for prompt resolution. Assist in customer installations and provide technical training as required. Provide support for highly technical or sophisticated products to customers and users. Willingness to travel globally up to 50% of the time to support field operations. What We Are Seeking:Master’s or PhD in Chemical Engineering, Materials Science, Mechanical or Electrical Engineering, or a related field.

About the job

 

Embark on a rewarding career with ASM, where innovation meets collaboration.

For more than 55 years, ASM has been a leader in technology and innovation, paving the way for what’s technologically possible. With a diverse team of over 4,500 ASMers from 70 nationalities, we are at the forefront of groundbreaking trends such as 5G, cloud computing, AI, and autonomous driving. More than just a tech company, we champion diversity, inclusion, and sustainability, making a positive impact on the world. Our development programs are designed to support your growth, shaping your future and pushing the boundaries of innovation.

In the role of (Senior) Principal Engineer in Process and Hardware, Advanced Packaging, you will be instrumental in advancing ASM’s semiconductor process technologies. Your expertise in thin-film deposition and materials characterization will be pivotal in developing innovative solutions for next-generation devices. Your contributions will directly enhance product performance and facilitate breakthroughs across logic, memory, and power applications. We are currently looking for multiple candidates to join our dynamic team.

About ASM International

ASM International is a global leader in the semiconductor equipment industry, dedicated to pushing the boundaries of technology. We prioritize innovation, diversity, and sustainability, fostering a collaborative environment that empowers our team to make meaningful contributions to cutting-edge advancements in semiconductor technology.

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