About the job
Join our dynamic team as a Device Physical Failure Analysis (PFA) Engineer at SanDisk, where your expertise in scanning electron microscopy (SEM) and focused ion beam (FIB) techniques will be pivotal in advancing semiconductor chip and package innovations. In this critical role within the Chip Package Integration (CPI) Failure Analysis function, you will enhance device reliability and contribute to impactful package and product designs. Your collaboration will span wafer fabrication (NAND and ASIC), package and product design, electrical and physical characterization, assembly R&D, and various engineering groups.
KEY RESPONSIBILITIES:
- Conduct comprehensive device-level physical failure analysis (PFA) utilizing SEM and FIB techniques (mandatory).
- Execute FIB cross-sectioning, delayering, and defect localization to identify root causes.
- Leverage SEM imaging for in-depth analysis of device structures, interfaces, and failure mechanisms.
- Drive chip structure optimization through insightful FA results and recommendations.
- Assess package reliability and resilience in relation to fabrication process modifications.
- Facilitate package evaluations and qualifications for NAND and ASIC technologies.
- Establish and sustain package recipes and process baselines informed by FA findings.
- Diagnose and rectify structural and packaging-related reliability challenges.
- Deliver FA insights that inform package and product design strategies.
- Collaborate effectively with fab process, package design, assembly R&D, and characterization teams.

