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Staff Engineer, Packaging Engineering - Device Physical Failure Analysis

SanDiskBatu Kawan
On-site Full-time

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Experience Level

Mid to Senior

Qualifications

REQUIREMENTS:Bachelor’s degree or higher in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related fields. Over 3 years of hands-on experience with SEM and FIB (essential). Proven expertise in physical failure analysis (PFA) of semiconductor devices. Deep understanding of device structures, packaging architectures, and failure mechanisms. Excellent English communication skills, both verbal and written. Adept at working collaboratively in cross-functional, global teams. PREFERRED:Experience in wafer fabrication processes and device design. Familiarity with NAND and/or ASIC technologies. Knowledge of electrical and physical characterization methods. Insight into assembly processes and advanced semiconductor packaging. Experience in supporting fab or package process change qualifications.

About the job

Join our dynamic team as a Device Physical Failure Analysis (PFA) Engineer at SanDisk, where your expertise in scanning electron microscopy (SEM) and focused ion beam (FIB) techniques will be pivotal in advancing semiconductor chip and package innovations. In this critical role within the Chip Package Integration (CPI) Failure Analysis function, you will enhance device reliability and contribute to impactful package and product designs. Your collaboration will span wafer fabrication (NAND and ASIC), package and product design, electrical and physical characterization, assembly R&D, and various engineering groups.

KEY RESPONSIBILITIES:

  • Conduct comprehensive device-level physical failure analysis (PFA) utilizing SEM and FIB techniques (mandatory).
  • Execute FIB cross-sectioning, delayering, and defect localization to identify root causes.
  • Leverage SEM imaging for in-depth analysis of device structures, interfaces, and failure mechanisms.
  • Drive chip structure optimization through insightful FA results and recommendations.
  • Assess package reliability and resilience in relation to fabrication process modifications.
  • Facilitate package evaluations and qualifications for NAND and ASIC technologies.
  • Establish and sustain package recipes and process baselines informed by FA findings.
  • Diagnose and rectify structural and packaging-related reliability challenges.
  • Deliver FA insights that inform package and product design strategies.
  • Collaborate effectively with fab process, package design, assembly R&D, and characterization teams.

About SanDisk

SanDisk is at the forefront of data consumption, driving relentless innovation to deliver solutions that meet today’s demands and pave the way for tomorrow’s ideas. Our legacy of pioneering advancements in Flash and cutting-edge memory technologies has positioned our solutions as essential components of the modern digital landscape. We empower individuals and businesses to realize their aspirations by combining our robust manufacturing capabilities with an award-winning portfolio of globally recognized products known for their innovation, performance, and quality. Recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations, our facilities exemplify excellence in sustainable and efficient operations, setting benchmarks in the industry.

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